Use Cases
The MODUL4R project will explore its innovation and strategies in 4 Use cases.
FFT will demonstrate a flexible and modular CPPS for automatised assembly of printed circuit boards (PCBs). The hybrid assembly will be capable of automatically sensing, detecting and assembling a variety of components.
1
Flexible and modular CPPS for automatised assembly of printed circuit boards (PCBs)
The application is projected to achieve 20% faster production, decrease ramp-up cost by up to 50%, and additional 5% part costs reduction through faster and easier product-shifting.
2
Specialised mould manufacturing for the automotive sector
The target of EMO pilot line is to reduce the production times, wastes, costs and energy by achieving fast response to early detection of failures at any manufacturing stage by developing a digital thread with bidirectional dataflow linking a wide range of processes.
The pilot is projected to significantly decrease ramp-up costs and achieve savings through less iterations and early detection of failures.
NECO’s Use Case in MODUL4R will demonstrate a flexible and modular finishing system for highly customised taps for application in aero and windmill manufacturing sectors. This will be explored through connecting control dimensional and precision instrumentation solutions through universal and orchestrated interfaces.
3
Highly customised taps for application in aero and windmill manufacturing
The pilot aims to achieve a decrease in ramp-up of 30% mostly by time reduction, while also decreasing costs by 30% through reduced waste and finishing cycles. Further decrease in parts cost of 15% through faster product control.
The SSF use case will feature an extremely flexible modular machine, designed for automated Through-Hole Technology (THT) soldering. Made up of four modular systems, this solution makes production changes simple and permits the rapid reconfiguration of the machine’s capabilities, thereby enhancing the resilience and adaptability of supply chains.
4
Highly flexible, modular machine for automated Through-Hole Technology (THT) soldering for circuit boards
This use-case aims to showcase the benefits of a modular manufacturing machine, specifically by reducing ramp-up costs. The objective is to demonstrate the advantages of early detection of failures and defects, highlighting the machine's ability to enhance production efficiency and quality.
